Lead-free electronic soldersSUBRAMANIAN, K. N.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, issn 0957-4522, 366 p.Serial Issue

Filler materials : the current situation and future trends with particular reference to lead-free soldering alloysZACCARIA, B.Welding international. 2001, Vol 15, Num 7, pp 545-550, issn 0950-7116Article

New metallurgical systems for electronic soldering applicationsGONCALVES, C; FERREIRA, J; FORTUNATO, E et al.Sensors and actuators. A, Physical. 1999, Vol 74, Num 1-3, pp 70-76, issn 0924-4247Conference Paper

Determining solder alloy and base metal compatibilitySHAPIRO, Alexander E.Welding journal. 2007, Vol 86, Num 9, pp 33-34, issn 0043-2296, 2 p.Article

Lead-Free Solders and Materials Issues in Microelectronic PackagingJournal of electronic materials. 2002, Vol 31, Num 11, pp 1129-1308, issn 0361-5235, 180 p.Conference Proceedings

On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parametersDI MAIO, D; HUNT, C. P.Soldering & surface mount technology. 2009, Vol 21, Num 4, pp 24-31, issn 0954-0911, 8 p.Article

Reliability and microstructure of lead-free solder die attach interface in silicon power devicesHUFF, D; KATSIS, D; STINSON-BAGBY, K et al.IEEE international reliability physics symposium. 2004, pp 567-568, isbn 0-7803-8315-X, 1Vol, 2 p.Conference Paper

Analysis of ring and plug shear strengths for comparison of lead-free soldersFOLEY, J. C; GICKLER, A; LEPREVOST, F. H et al.Journal of electronic materials. 2000, Vol 29, Num 10, pp 1258-1263, issn 0361-5235Conference Paper

Surface tension and density of binary lead and lead-free Sn-based soldersKABAN, I; MHIAOUI, S; HOYER, W et al.Journal of physics. Condensed matter (Print). 2005, Vol 17, Num 50, pp 7867-7873, issn 0953-8984, 7 p.Article

Experiments and simulations of uniaxial ratchetting deformation of Sn-3Ag-0.5Cu and Sn-37Pb solder alloysKOBAYASHI, Takuji; SASAKI, Katsuhiko.Journal of materials science. Materials in electronics. 2009, Vol 20, Num 4, pp 343-353, issn 0957-4522, 11 p.Article

Rapid assessment of steady-state creep rates and stress dip effects in solder alloysGREASLEY, A.Journal of materials science. Materials in electronics. 2002, Vol 13, Num 1, pp 43-47, issn 0957-4522Article

Study on low-Ag content Sn-Ag-Zn/Cu solder jointsTINGBI LUO; ZHUO CHEN; ANMIN HU et al.Microelectronics and reliability. 2013, Vol 53, Num 12, pp 2018-2029, issn 0026-2714, 12 p.Article

Sn addition on the tensile properties of high temperature Zn-4Al-3Mg solder alloysFANGJIE CHENG; FENG GAO; YAN WANG et al.Microelectronics and reliability. 2012, Vol 52, Num 3, pp 579-584, issn 0026-2714, 6 p.Article

Effect of adding Ce on interfacial reactions between Sn-Ag solder and CuYOON, Jeong-Won; NOH, Bo-In; CHOI, Jung-Hyun et al.Journal of materials science. Materials in electronics. 2011, Vol 22, Num 7, pp 745-750, issn 0957-4522, 6 p.Article

Design, materials, and assembly process of high-density packages with a low-temperature lead-free solder (SnBiAg)LAU, John; GLEASON, Jerry; SCHROEDER, Valeska et al.Soldering & surface mount technology. 2008, Vol 20, Num 2, pp 11-20, issn 0954-0911, 10 p.Article

Investigation of stress exponent in the room-temperature creep of Sn-40Pb-2.5Sb solder alloyMAHMUDI, R; REZAEE-BAZZAZ, A; BANAIE-FARD, H. R et al.Journal of alloys and compounds. 2007, Vol 429, Num 1-2, pp 192-197, issn 0925-8388, 6 p.Article

Learning from the migration to lead-free solderCIOCCI, Richard; PECHT, Michael.Soldering & surface mount technology. 2006, Vol 18, Num 3, pp 14-18, issn 0954-0911, 5 p.Article

Failure analysis techniques for lead-free solder jointsCASTELLO, Todd; ROONEY, Dan; SHANGGUAN, Dongkai et al.Soldering & surface mount technology. 2006, Vol 18, Num 4, pp 21-27, issn 0954-0911, 7 p.Article

Dissolution rates of iron plating on soldering iron tips in molten lead-free soldersTAKEMOTO, Tadashi; UETANI, Takashi; YAMAZAKI, Morio et al.Soldering & surface mount technology. 2004, Vol 16, Num 3, pp 9-15, issn 0954-0911, 7 p.Article

Brazing and soldering conference: Atracts the expertsCULLISON, Andrew.Welding journal. 2003, Vol 82, Num 1, pp 37-41, issn 0043-2296, 5 p.Article

Phase equilibria and thermodynamic properties of Sn-Ag based Pb-free solder alloysOHNUMA, Ikuo; MIYASHITA, Masamitsu; XING JUN LIU et al.IEEE transactions on electronics packaging manufacturing. 2003, Vol 26, Num 1, pp 84-89, issn 1521-334X, 6 p.Article

Estimation of liquidus temperature of Sn-based alloys and its application to the design of Pb-free solderEZAKI, H; NAMBU, T; NINOMIYA, R et al.Journal of materials science. Materials in electronics. 2002, Vol 13, Num 5, pp 269-272, issn 0957-4522Article

Microstructural characterization of damage in thermomechanically fatigued Sn-Ag based solder jointsCHOI, S; LEE, J. G; SUBRAMANIAN, K. N et al.Journal of electronic materials. 2002, Vol 31, Num 4, pp 292-297, issn 0361-5235Article

Creep behaviour of lead free and lead containing solder materials at high homologous temperatures with regard to small solder volumesVILLAIN, J; BRUELLER, O. S; QASIM, T et al.Sensors and actuators. A, Physical. 2002, Vol 99, Num 1-2, pp 194-197, issn 0924-4247, 4 p.Conference Paper

Effects of reflow conditions on the formation of Au-Ni-Sn compounds at the interface of Au-Pb-Sn and Au-Sn solder joints with Ni substrateKINYANJUI, Robert K; ZRIBI, Anis; COTTS, Eric J et al.Proceedings - Electronic Components Conference. 2002, pp 161-167, issn 0569-5503, isbn 0-7803-7430-4, 7 p.Conference Paper